9/17/97 IRL3302S preliminary hexfet ? power mosfet pd - 9.1692a s d g v dss = 20v r ds(on) = 0.020 w i d = 39a description parameter typ. max. units r q jc junction-to-case CCC 2.2 r q ja junction-to-ambient ( pcb mounted,steady-state)** CCC 40 c/w thermal resistance parameter max. units i d @ t c = 25c continuous drain current, v gs @ 4.5v ? 39 i d @ t c = 100c continuous drain current, v gs @ 4.5v ? 25 a i dm pulsed drain current ?? 160 p d @t c = 25c power dissipation 57 w linear derating factor 0.45 w/c v gs gate-to-source voltage 10 v e as single pulse avalanche energy ?? 130 mj i ar avalanche current ? 23 a e ar repetitive avalanche energy ? 5.7 mj dv/dt peak diode recovery dv/dt ?? 5.0 v/ns t j operating junction and -55 to + 150 t stg storage temperature range soldering temperature, for 10 seconds 300 (1.6mm from case ) c absolute maximum ratings these hexfet power mosfets were designed specifically to meet the demands of cpu core dc-dc converters. advanced processing techniques combined with an optimized gate oxide design results in a die sized specifically to offer maximum efficiency at minimum cost. the d 2 pak is a surface mount power package capable of accommodating die sizes up to hex-4. it provides the highest power capability and the lowest possible on- resistance in any existing surface mount package. the d 2 pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0w in a typical surface mount application. 2 d pak l advanced process technology l surface mount l optimized for 4.5v-7.0v gate drive l ideal for cpu core dc-dc converters l fast switching
IRL3302S ? repetitive rating; pulse width limited by max. junction temperature. ? i sd 23a, di/dt 97a/s, v dd v (br)dss , t j 150c notes: ? starting t j = 25c, l = 0.49mh r g = 25 w , i as = 23a. ? pulse width 300s; duty cycle 2%. s d g parameter min. typ. max. units conditions i s continuous source current mosfet symbol (body diode) CCC CCC showing the i sm pulsed source current integral reverse (body diode) ?? CCC CCC p-n junction diode. v sd diode forward voltage CCC CCC 1.3 v t j = 25c, i s = 23a, v gs = 0v ? t rr reverse recovery time CCC 62 94 ns t j = 25c, i f = 23a q rr reverse recovery charge CCC 110 160 nc di/dt = 100a/s ?? t on forward turn-on time intrinsic turn-on time is negligible (turn-on is dominated by l s +l d ) source-drain ratings and characteristics 39 160 a parameter min. typ. max. units conditions v (br)dss drain-to-source breakdown voltage 20 CCC CCC v v gs = 0v, i d = 250a d v (br)dss / d t j breakdown voltage temp. coefficient CCC 0.022 CCC v/c reference to 25c, i d = 1ma ? CCC CCC 0.023 v gs = 4.5v, i d = 23a ? CCC CCC 0.020 w v gs = 7.0v, i d = 23a ? v gs(th) gate threshold voltage 0.70 CCC CCC v v ds = v gs , i d = 250a g fs forward transconductance 21 CCC CCC s v ds = 10v, i d = 23a ? CCC CCC 25 a v ds = 20v, v gs = 0v CCC CCC 250 v ds = 10v, v gs = 0v, t j = 150c gate-to-source forward leakage CCC CCC 100 na v gs = 10v gate-to-source reverse leakage CCC CCC -100 v gs = -10v q g total gate charge CCC CCC 31 i d = 23a q gs gate-to-source charge CCC CCC 5.7 nc v ds = 16v q gd gate-to-drain ("miller") charge CCC CCC 13 v gs = 4.5v, see fig. 6 ?? t d(on) turn-on delay time CCC 7.2 CCC v dd = 10v t r rise time CCC 110 CCC ns i d = 23a t d(off) turn-off delay time CCC 41 CCC r g = 9.5 w , v gs = 4.5v t f fall time CCC 89 CCC r d = 2.4 w , ?? between lead, and center of die contact c iss input capacitance CCC 1300 CCC v gs = 0v c oss output capacitance CCC 520 CCC pf v ds = 15v c rss reverse transfer capacitance CCC 190 CCC ? = 1.0mhz, see fig. 5 ? electrical characteristics @ t j = 25c (unless otherwise specified) r ds(on) static drain-to-source on-resistance i gss nh l s internal source inductance CCC 7.5 CCC i dss drain-to-source leakage current ? uses irl3302 data and test conditions ** when mounted on fr-4 board using minimum recommended footprint. for recommended footprint and soldering techniques refer to application note #an-994.
IRL3302S fig 4. normalized on-resistance vs. temperature fig 2. typical output characteristics fig 1. typical output characteristics fig 3. typical transfer characteristics -60 -40 -20 0 20 40 60 80 100 120 140 160 0.0 0.5 1.0 1.5 2.0 t , junction temperature ( c) r , drain-to-source on resistance (normalized) j ds(on) v = i = gs d 4.5v 39a 10 100 1000 0.1 1 10 100 20s pulse width t = 25 c j top bottom vgs 15v 12v 10v 8.0v 6.0v 4.0v 3.0v 2.5v v , drain-to-source voltage (v) i , drain-to-source current (a) ds d 2.5v 10 100 1000 0.1 1 10 100 20s pulse width t = 150 c j top bottom vgs 15v 12v 10v 8.0v 6.0v 4.0v 3.0v 2.5v v , drain-to-source voltage (v) i , drain-to-source current (a) ds d 2.5v 1 10 100 1000 2 3 4 5 6 7 8 v = 15v 20s pulse width ds v , gate-to-source voltage (v) i , drain-to-source current (a) gs d t = 25 c j t = 150 c j vgs top 10v 8.0v 6.0v 4.0v 3.0v bottom 2.5v vgs top 10v 8.0v 6.0v 4.0v 3.0v bottom 2.5v
IRL3302S fig 8. maximum safe operating area fig 6. typical gate charge vs. gate-to-source voltage fig 5. typical capacitance vs. drain-to-source voltage fig 7. typical source-drain diode forward voltage 1 10 100 0 400 800 1200 1600 2000 2400 v , drain-to-source voltage (v) c, capacitance (pf) ds v c c c = = = = 0v, c c c f = 1mhz + c + c c shorted gs iss gs gd , ds rss gd oss ds gd c iss c oss c rss 0 10 20 30 40 50 0 3 6 9 12 15 q , total gate charge (nc) v , gate-to-source voltage (v) g gs i = d 23a v = 16v ds 1 10 100 1000 0.5 1.0 1.5 2.0 v ,source-to-drain voltage (v) i , reverse drain current (a) sd sd v = 0 v gs t = 25 c j t = 150 c j 1 10 100 1000 1 10 100 operation in this area limited by r ds(on) single pulse t t = 150 c = 25 c j c v , drain-to-source voltage (v) i , drain current (a) i , drain current (a) ds d 10us 100us 1ms 10ms
IRL3302S fig 11. maximum effective transient thermal impedance, junction-to-case fig 9. maximum drain current vs. case temperature fig 10. maximum avalanche energy vs. drain current 25 50 75 100 125 150 0 10 20 30 40 t , case temperature ( c) i , drain current (a) c d 25 50 75 100 125 150 0 50 100 150 200 250 300 starting t , junction temperature ( c) e , single pulse avalanche energy (mj) j as i d top bottom 10a 15a 23a 0.01 0.1 1 10 0.00001 0.0001 0.001 0.01 0.1 1 notes: 1. duty factor d = t / t 2. peak t = p x z + t 1 2 j dm thjc c p t t dm 1 2 t , rectangular pulse duration (sec) thermal response (z ) 1 thjc 0.01 0.02 0.05 0.10 0.20 d = 0.50 single pulse (thermal response)
IRL3302S 4 5 6 7 8 9 10 0.014 0.015 0.016 0.017 0.018 0.019 0.020 r , drain-to-source on resistance v , gate-to-source voltage (v) gs ds (on) id = 39a 0 10 20 30 40 0.016 0.017 0.018 0.019 0.020 0.021 0.022 r , drain-to-source on resistance i , drain current (a) d ds (on) vgs = 7.0v vgs = 4.5v fig 12. on-resistance vs. drain current fig 13. on-resistance vs. gate voltage ( w ) ( w )
IRL3302S d 2 pak part marking information 10.16 (.400) ref . 6.47 (.255) 6.18 (.243) 2.61 (.103) 2.32 (.091) 8.89 (.350) r ef. - b - 1.32 (.052) 1.22 (.048) 2.79 (.110) 2.29 (.090) 1.39 (.055) 1.14 (.045) 5.28 (.208) 4.78 (.188) 4.69 (.185) 4.20 (.165) 10.54 (.415) 10.29 (.405) - a - 2 1 3 15.49 (.610) 14.73 (.580) 3x 0.93 (.037) 0.69 (.027) 5.08 (.200) 3x 1.40 (.055) 1.14 (.045) 1.78 (.070) 1.27 (.050) 1.40 (.055) m ax. notes: 1 d im ens io n s after so ld er d ip. 2 dimensioning & tolerancing per ansi y14.5m, 1982. 3 controlling dimension : inch. 4 heatsink & lead dimensions do not include burrs. 0.55 (.022) 0.46 (.018) 0.25 (.010) m b a m minimum recommended footprint 11.43 (.450) 8.89 (.350) 17.78 (.700) 3.81 (.150) 2.08 (.082) 2x lead assignments 1 - g ate 2 - d rain 3 - so u rc e 2.54 (.100) 2x part number international rectifier logo date code (yyw w ) yy = year ww = week a ssem bly lot code f530s 9b 1m 9246 a d 2 pak package outline
IRL3302S world headquarters: 233 kansas st., el segundo, california 90245, tel: (310) 322 3331 european headquarters: hurst green, oxted, surrey rh8 9bb, uk tel: ++ 44 1883 732020 ir canada: 7321 victoria park ave., suite 201, markham, ontario l3r 2z8, tel: (905) 475 1897 ir germany: saalburgstrasse 157, 61350 bad homburg tel: ++ 49 6172 96590 ir italy: via liguria 49, 10071 borgaro, torino tel: ++ 39 11 451 0111 ir far east: k&h bldg., 2f, 30-4 nishi-ikebukuro 3-chome, toshima-ku, tokyo japan 171 tel: 81 3 3983 0086 ir southeast asia: 315 outram road, #10-02 tan boon liat building, singapore 0316 tel: 65 221 8371 http://www.irf.com/ data and specifications subject to change without notice. 9/97 3 4 4 trr feed direction 1.85 (.073) 1.65 (.065) 1.60 (.063) 1.50 (.059) 4.10 (.161) 3.90 (.153) trl feed direction 10.90 (.429) 10.70 (.421) 16.10 (.634) 15.90 (.626) 1.75 (.069) 1.25 (.049) 11.60 (.457) 11.40 (.449) 15.42 (.609) 15.22 (.601) 4.72 (.136) 4.52 (.178) 24.30 (.957) 23.90 (.941) 0.368 (.0145) 0.342 (.0135) 1.60 (.063) 1.50 (.059) 13.50 ( .532 ) 12.80 ( .504 ) 330.00 (14.173) max. 27.40 ( 1.079 ) 23.90 ( .941 ) 60.00 ( 2.362 ) m in . 30.40 ( 1.197 ) m ax. 26.40 (1.039) 24.40 (.961) notes : 1. comform s to eia-418. 2. controlling dimension: millimeter. 3. dimension measured @ hub. 4. includes flange distortion @ outer edge. tape & reel information d 2 pak
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